NXP Semiconductors
IP4284CZ10-TBR/TT
ESD protection for ultra high-speed interfaces
9. Soldering
Footprint information for reflow soldering of XSON10 package
Hx
C
SOT1176-1
Hy
Ay
By
0.05
D
P
0.05
Generic footprint pattern
Refer to the package outline drawing for actual layout
solder land
solder paste deposit
solder land plus solder paste
occupied area
solder resist
Dimensions in mm
P
Ay
By
C
D
Hx
Hy
Remark:
Stencil of 75 μ m is recommended.
0.5
1.25
0.3
0.475
0.2
2.45
1.5
A stencil of 75 μ m gives an aspect ratio of 0.77
With a stencil of 100 μ m one will obtain an aspect ratio of 0.58
sot1176-1_fr
Reflow soldering is the only recommended soldering method.
Fig 14. Reflow soldering footprint SOT1176-1 (XSON10)
IP4284CZ10-TBR_TT
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 19 May 2011
? NXP B.V. 2011. All rights reserved.
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